Thin Film Deposition

DESCRIPTION

Terfenol-D, an intermetallic compound of Fe-Tb-Dy, is a well-known magnetoelastic material.  It plays a key role in both direct and converse multiferroic applications due to its strong coupling between magnetization and strain. In comparison with bulk Terfenol-D, thin film Terfenol-D has distinctive advantages such as CMOS compatible fabrication process, improved ductility, moderately hard magnetic properties, etc.

APPLICATIONS

• Acoustic devices (e.g. sonar and speakers)

• Magnetometers

• Micro magnetorhelogical fluid control

• Inductive charging

• Energy harvesting

• CMOS integration

OPTIONS

• Deposition Thickness: between 50 to 200 nm

• Compatible Substrates requirements:

  • • Material: Si, Sapphire and PMN-PT

    • Maximum Substrate size: 4” in diameter

    • Maximum Substrate thickness: 500um

PUBLICATIONS

• https://doi.org/10.1063/1.5006676 

• https://doi.org/10.1063/1.4930602